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| General information | |||||||||
| Type | CPU / Processor | ||||||||
| Market segment | Server | ||||||||
| Family | Intel Xeon 3600 | ||||||||
| Model number | W3670 | ||||||||
| CPU part numbers | AT80613005490AC is an OEM/tray microprocessor BX80613W3670 is a boxed microprocessor |
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| Frequency (MHz) | 3200 | ||||||||
| Turbo frequency (MHz) | 3467 | ||||||||
| Bus speed (MHz) | 2400 MHz QPI | ||||||||
| Clock multiplier | 24 | ||||||||
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) | ||||||||
| Socket | Socket 1366 (LGA 1366) | ||||||||
| Size | 1.77" x 1.67" / 4.5cm x 4.25cm | ||||||||
| S-spec numbers | |||||||||
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| Architecture / Microarchitecture | |||||||||
| Platform | Tylersburg-WS | ||||||||
| Core stepping | B1 (SLBVE) | ||||||||
| Manufacturing process | 0.032 micron High-K metal gate process | ||||||||
| Data width | 64 bit | ||||||||
| Number of cores | 6 | ||||||||
| Floating Point Unit | Integrated | ||||||||
| Level 1 cache size | 6 x 32 KB instruction caches 6 x 32 KB data caches |
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| Level 2 cache size | 6 x 256 KB | ||||||||
| Level 3 cache size | 12 MB | ||||||||
| Physical memory (GB) | 24 | ||||||||
| Multiprocessing | Uniprocessor | ||||||||
| Features |
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| Low power features | Enhanced SpeedStep technology | ||||||||
| On-chip peripherals |
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| Electrical/Thermal parameters | |||||||||
| V core (V) | 0.8 - 1.375 | ||||||||
| Maximum operating temperature (°C) | 67.9 | ||||||||
| Thermal Design Power (W) | 130 | ||||||||
| Notes on Intel AT80613005490AC | |||||||||
|
|||||||||
| General information | |||||||||
| Type | CPU / Processor | ||||||||
| Market segment | Server | ||||||||
| Family | Intel Xeon 3600 | ||||||||
| Model number | W3670 | ||||||||
| CPU part numbers | AT80613005490AC is an OEM/tray microprocessor BX80613W3670 is a boxed microprocessor |
||||||||
| Frequency (MHz) | 3200 | ||||||||
| Turbo frequency (MHz) | 3467 | ||||||||
| Bus speed (MHz) | 2400 MHz QPI | ||||||||
| Clock multiplier | 24 | ||||||||
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) | ||||||||
| Socket | Socket 1366 (LGA 1366) | ||||||||
| Size | 1.77" x 1.67" / 4.5cm x 4.25cm | ||||||||
| S-spec numbers | |||||||||
|
|||||||||
| Architecture / Microarchitecture | |||||||||
| Platform | Tylersburg-WS | ||||||||
| Core stepping | B1 (SLBVE) | ||||||||
| Manufacturing process | 0.032 micron High-K metal gate process | ||||||||
| Data width | 64 bit | ||||||||
| Number of cores | 6 | ||||||||
| Floating Point Unit | Integrated | ||||||||
| Level 1 cache size | 6 x 32 KB instruction caches 6 x 32 KB data caches |
||||||||
| Level 2 cache size | 6 x 256 KB | ||||||||
| Level 3 cache size | 12 MB | ||||||||
| Physical memory (GB) | 24 | ||||||||
| Multiprocessing | Uniprocessor | ||||||||
| Features |
|
||||||||
| Low power features | Enhanced SpeedStep technology | ||||||||
| On-chip peripherals |
|
||||||||
| Electrical/Thermal parameters | |||||||||
| V core (V) | 0.8 - 1.375 | ||||||||
| Maximum operating temperature (°C) | 67.9 | ||||||||
| Thermal Design Power (W) | 130 | ||||||||
| Notes on Intel AT80613005490AC | |||||||||
|
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