Giỏ hàng đang trống!

| General information | |
| Type | CPU |
| Market segment | Desktop |
| Family | Intel Core i7 Extreme Edition |
| Model number | I7-990X |
| CPU part number | AT80613005931AA |
| Box part number | BX80613I7990X |
| Frequency (MHz) | 3467 |
| Turbo frequency (MHz) | 3733 |
| Bus speed (MHz) | 3200 MHz QPI |
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) |
| Socket | Socket 1366 |
| Size | 1.77" x 1.67" / 4.5cm x 4.25cm |
| Architecture / Microarchitecture | |
| Microarchitecture | Nehalem (Westmere) |
| Platform | 2010 HEDT |
| Processor core | Gulftown |
| Manufacturing process | 0.032 micron High-K metal gate process 1170 million transistors |
| Data width | 64 bit |
| Number of cores | 6 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 6 x 32 KB instruction caches 6 x 32 KB data caches |
| Level 2 cache size | 6 x 256 KB |
| Level 3 cache size | 12 MB |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features | Enhanced SpeedStep technology |
| On-chip peripherals |
|
| Electrical/Thermal parameters | |
| Thermal Design Power (W) | 130 |
| General information | |
| Type | CPU |
| Market segment | Desktop |
| Family | Intel Core i7 Extreme Edition |
| Model number | I7-990X |
| CPU part number | AT80613005931AA |
| Box part number | BX80613I7990X |
| Frequency (MHz) | 3467 |
| Turbo frequency (MHz) | 3733 |
| Bus speed (MHz) | 3200 MHz QPI |
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) |
| Socket | Socket 1366 |
| Size | 1.77" x 1.67" / 4.5cm x 4.25cm |
| Architecture / Microarchitecture | |
| Microarchitecture | Nehalem (Westmere) |
| Platform | 2010 HEDT |
| Processor core | Gulftown |
| Manufacturing process | 0.032 micron High-K metal gate process 1170 million transistors |
| Data width | 64 bit |
| Number of cores | 6 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 6 x 32 KB instruction caches 6 x 32 KB data caches |
| Level 2 cache size | 6 x 256 KB |
| Level 3 cache size | 12 MB |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features | Enhanced SpeedStep technology |
| On-chip peripherals |
|
| Electrical/Thermal parameters | |
| Thermal Design Power (W) | 130 |