Intel Quad Core Core i7-975 3.33Ghz Extreme

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General information
Model number	I7-975
CPU part number	AT80601002274AA
Box part number	BX80601975
Frequency (MHz)	3333
Bus speed (MHz)	3200 MHz QPI
Package	1366-land Flip-Chip Land Grid Array (FC-LGA8)
Socket	Socket 1366

Architecture / Microarchitecture
Processor core	Bloomfield
Core stepping	D0 (SLBEQ)
Manufacturing process	0.045 micron Hi-k metal gate technology 731 million transistors
Die size	263 mm²
Data width	64 bit
Number of cores	4
Floating Point Unit	Integrated
Level 1 cache size	4 x 32 KB instruction caches 4 x 32 KB data caches
Level 2 cache size	4 x 256 KB
Level 3 cache size	Inclusive shared 8 MB cache
Features	MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Hyper-Threading technology Turbo Boost technology Virtualization technology Execute Disable bit
Low power features	Thread C1, C3 and C6 states Core C1, C3 and C6 states Package C3 and C6 states Enhanced SpeedStep technology
On-chip peripherals	Integrated triple-channel DDR3 SDRAM Memory controller Quick Path Interconnect

Electrical/Thermal parameters
V core (V)	0.8 - 1.375
Minimum/Maximum operating temperature (°C)	5 - 67.9
Minimum/Maximum power dissipation (W)	12 (TDP in C6 state) / 230.14
Thermal Design Power (W)	130

Notes on Intel AT80601002274AA
Processor has unlocked multiplier

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Mô tả

General information
Model number	I7-975
CPU part number	AT80601002274AA
Box part number	BX80601975
Frequency (MHz)	3333
Bus speed (MHz)	3200 MHz QPI
Package	1366-land Flip-Chip Land Grid Array (FC-LGA8)
Socket	Socket 1366

Architecture / Microarchitecture
Processor core	Bloomfield
Core stepping	D0 (SLBEQ)
Manufacturing process	0.045 micron Hi-k metal gate technology 731 million transistors
Die size	263 mm²
Data width	64 bit
Number of cores	4
Floating Point Unit	Integrated
Level 1 cache size	4 x 32 KB instruction caches 4 x 32 KB data caches
Level 2 cache size	4 x 256 KB
Level 3 cache size	Inclusive shared 8 MB cache
Features	MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Hyper-Threading technology Turbo Boost technology Virtualization technology Execute Disable bit
Low power features	Thread C1, C3 and C6 states Core C1, C3 and C6 states Package C3 and C6 states Enhanced SpeedStep technology
On-chip peripherals	Integrated triple-channel DDR3 SDRAM Memory controller Quick Path Interconnect

Electrical/Thermal parameters
V core (V)	0.8 - 1.375
Minimum/Maximum operating temperature (°C)	5 - 67.9
Minimum/Maximum power dissipation (W)	12 (TDP in C6 state) / 230.14
Thermal Design Power (W)	130

Notes on Intel AT80601002274AA
Processor has unlocked multiplier